A new IEEE technical paper titled “Package Assembly Design Kits (PADK’s)- The Future of Advanced Wafer-Level Manufacturing” was written by researchers from Amkor. Find the technical paper here.
TEMPE, Ariz.--(BUSINESS WIRE)--Amkor Technology, Inc. (NASDAQ: AMKR), a leading outsourced semiconductor packaging and test service provider, today announced the expansion of its collaboration with ...
In 2003, Stephen Kieran and James Timberlake wrote Refabricating Architecture, a book that argued the time had come to reevaluate and update basic design and construction methods that have constrained ...
products and its services is available at http://www.cadence.com. Note: The Amkor name and logo are registered trademarks, and SLIM and SWIFT are trademarks of Amkor ...
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