International Sematech engineers have qualified a porous, ultra low-k material for dual damascene copper processing at 0.13-micron feature sizes using 193nm lithography on 300mm wafers, the consortium ...
One of the main challenges of a Dual Damascene (DD) via-first process is the control of the Critical Dimensions (CDs) in the lithography of the trenches. The PhotoResist (PhR) thickness presents ...
Imec has presented a dual-damascene 21nm pitch test vehicle relevant for manufacturing the 3nm logic technology node. With this test vehicle, a 30% improvement in resistance-capacitance product (RC) ...
MINNEAPOLIS–FSI International Inc. said it has signed a cooperative agreement with Novellus Systems Inc. to join the Damascus Alliance. The alliance is a group of semiconductor equipment companies ...
Leuven, Belgium. At this week’s 2018 IEEE International Interconnect Technology Conference (IITC 2018), imec is presenting 11 papers on advanced interconnects, ranging from extending Cu and Co ...
imec has demonstrated electrically functional 2-metal-level interconnects fabricated with Ru semi-damascene and airgap technology showing a long lifetime and good mechanical strength. A complementary ...
imec has presented, at this year’s IEEE International Interconnect Technology Conference, a number of options that are able to reduce the metal line resistance at tight metal pitches, and in the ...
Sematech qualifies porous low-k for dual damasceneJeff Chappell at ElectronicNews OnlineInternational Sematech engineers have qualified a porous, ultra low-k material for dual damascene copper ...
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