System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

For system-in-package (SIP) on laminate applications, the Hysol GR9810 epoxy molding compound is designed for use as an over-mold on a variety of laminate-based molded array packages including SIP and ...