This paper presents SoC- (System on Chip) level functional verification flow. It also describes ways to speed up the process. To ensure successful tapeout of SoCs, here are the steps of a standard SoC ...

Power integrity has become one the most critical issues as chip designs have transitioned to 130nm and 90nm processing technologies. Decreasing supply voltages, increasing device density and leakage ...

Samsung Foundry and Synopsys' optimized flow achieves predictable execution of in-system test, implementation, verification, timing and physical signoff for ASIL D-compliant SoC design Includes ...

RFICs (Radio Frequency Integrated Circuits) for wireless data transmission systems, such as transceivers and RF front-end components, are becoming more complex based on the demands of our connected ...

Wafer-level packaging enables higher form factor and improved performance compared to traditional SoC designs. However, to ensure an acceptable yield and performance, EDA companies, OSAT companies, ...